Thermal modeling and decentralized control of mold temperature for a vulcanization test bench

verfasst von
Steffen Bosselmann, Tobias Frank, Mark Wielitzka, Matthias Dagen, Tobias Ortmaier
Abstract

Mold temperature is a decisive process parameter during vulcanization of rubber articles. Hence, ensuring a homogeneous temperature distribution over the entire mold surface throughout the curing process is a crucial requirement. Therefore, we present a model-based approach to analyze heat propagation within the mold and to design a controller for mold surface temperature. The thermal model of the process was build by means of the heat equation utilizing spatial discretization. Simulations indicated, that the order of the resulting model can be reduced by moment-matching methods maintaining sufficient accuracy. Subsequently, a decentralized PI-controller was designed based on the reduced thermal process model. Reference tracking and disturbance rejection were investigated in simulation and experiment for a vulcanization test bench. The evaluated controller setup allows for fast wide range reference changes and proper compensation of disturbances and eventually, desired homogeneity in mold surface temperature distribution is achieved.

Organisationseinheit(en)
Institut für Mechatronische Systeme
Typ
Aufsatz in Konferenzband
Seiten
377-382
Anzahl der Seiten
6
Publikationsdatum
06.10.2017
Publikationsstatus
Veröffentlicht
Peer-reviewed
Ja
ASJC Scopus Sachgebiete
Theoretische Informatik, Hardware und Architektur, Software, Steuerungs- und Systemtechnik
Elektronische Version(en)
https://doi.org/10.1109/ccta.2017.8062491 (Zugang: Geschlossen)